WAFER DICING Services
What is Wafer Dicing?
Wafer dicing is the precise separation of individual die (chips or integrated circuits) from a semiconductor wafer. At American Dicing, we have expanded our dicing from semiconductor wafers to many other materials, including glass, sapphire, quartz, graphene, and ceramic. The list of materials we work with constantly expands as we develop new processes.
Why American Dicing?
American Dicing offers high precision dicing and scribing of silicon wafers. We also handle cutting materials such as quartz and sapphire. Wafer production services include dicing of up to 12 inch wafers. Our facility can handle small startup jobs, R&D, and large-scale production work of hundreds of wafers a month. Our range of automated and manual machines enables us to develop a process specific to each customer’s needs. We often dice custom jobs with unique requests.
Our Applications Expertise
Our detail-orientated, experienced staff optimizes the dicing process for each wafer using a variety of techniques. With over 30 years of experience, we will strive to create the best dicing process for each order.
We have extensive experience in working with:
Pizza-masked wafers (also known as multi-die wafers)
A large variety of materials
A variety of dicing blades and dicing tapes, including UV and non-UV tapes, to develop a job-specific process.
Our Dicing Capabilities
WAFER SIZES:
American Dicing works with wafers and samples from 5 mm to 300 mm.
WAFER THICKNESSES:
We have experience in processing wafers with thicknesses ranging from 50 µm to 15 mm (.002” - .600”)
DIE SIZES:
We have experience in singulating die as small as .295 mm.
BEVELING:
We offer beveling surfaces post-dicing to provide a polished edge. We can provide bevels ranging from 4 to 70 mils.
Dicing Saws
ADT
7100, 7134 & 7200
K&S
980 & 7500
7100 Series
Pro Vectus 2”
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8” chuck
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Index accuracy — 1µm
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Z accuracy — 1µm
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2" spindle — 60,000 RPM
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Chuck flatness — 10µm
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ø — closed loop Theta
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Pattern recognition systems (PRS)
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Load monitor
Pro Fortis 4”
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Dice up to .600” thick
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4” spindle — 30,000 RPM
7134 Series
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12” Chuck
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Index accuracy – 1.0 µm
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Z accuracy – 1.0 µm
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4” Spindle – 30,000 RPM
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ø stroke - 380° for circle dicing capabilities
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Dice material up to .600” thick
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Full auto alignment as well as kerf check and cut verification
7200 Series
MegaDice
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Fully automatic — 12” capability
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2”-3” high-torque
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DC-brushless
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Air-bearing
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2.4KW
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60,000 RPM spindle
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Optimized for package singulation and IC applications
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Fully automatic saws for high production runs
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Surfactants and CO2 bubbler available
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Small or large quantities for all materials
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Custom dicing (slotting, multi depth, bevel, and angle cutting)
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Wafer sizes from .25” to 12” (300mm) diameter
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Substrates from .002" up to .6" thick
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Handle wafers on film frames or hoops, 100% saw-through (or as specified)
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Experience in image sensor dicing, RFID, solar panels, bonded wafers (Si on glass) MEMS devices
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Non-standard mask layouts (for handling many different size die on one substrate)
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Fully automatic saws for high production runs
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Surfactants and CO2 bubbler available
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Small or large quantities for all materials
-
Custom dicing (slotting, multi depth, bevel, and angle cutting)
-
Wafer sizes from .25” to 12” (300mm) diameter
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Substrates from .002" up to .6" thick
-
Handle wafers on film frames or hoops, 100% saw-through (or as specified)
-
Experience in image sensor dicing, RFID, solar panels, bonded wafers (Si on glass) MEMS devices
-
Non-standard mask layouts (for handling many different size die on one substrate)
