Wafer Dicing Services
High-Precision Silicon Wafer Dicing and Scribing
American Dicing offers high precision dicing and scribing of silicon wafers. We also handle cutting materials such as quartz and sapphire. Wafer production services include dicing of up to 12 inch wafers. Our wafer production facility is capable of handling small and large quantities of wafers and substrates.
Specifications
DICING:
Chamfered & Beveled
SCRIBING:
Chamfered & Beveled
WAFER SIZE:
Up to 12 Inch (300MM)
KERF:
Down to 0.0005 inch (0.015mm)
SUBSTRATE THICKNESS:
Up to 0.6 inch (15.24mm)
MATERIALS:
Silicon, AR Coated Glass, Borofloat, Copper, Alumia, Fused Silica, Titanate, Sapphire, Quartz, Garnet, Mold Compound, Magnesium, Natrium, Thin Films, Sodalime, Lead, Ceramics, Lithium Niobate & Lithium Tantalate, Gallium Arsenide.
Dicing Saws
Dicing Saws
ADT
7100, 7134 & 7200
K&S
980 & 7500
7100 Series
Pro Vectus 2”
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8” chuck
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Index accuracy — 1µm
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Z accuracy — 1µm
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2" spindle — 60,000 RPM
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Chuck flatness — 10µm
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ø — closed loop Theta
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Pattern recognition systems (PRS)
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Load monitor
Pro Fortis 4”
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Dice up to .600” thick
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4” spindle — 30,000 RPM
7134 Series
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12” Chuck
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Index accuracy – 1.0 µm
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Z accuracy – 1.0 µm
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4” Spindle – 30,000 RPM
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ø stroke - 380° for circle dicing capabilities
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Dice material up to .600” thick
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Full auto alignment as well as kerf check and cut verification
7200 Series
MegaDice
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Fully automatic — 12” capability
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2”-3” high-torque
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DC-brushless
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Air-bearing
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2.4KW
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60,000 RPM spindle
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Optimized for package singulation and IC applications
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Fully automatic saws for high production runs
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Surfactants and CO2 bubbler available
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Small or large quantities for all materials
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Custom dicing (slotting, multi depth, bevel, and angle cutting)
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Wafer sizes from .25” to 12” (300mm) diameter
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Substrates from .002" up to .6" thick
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Handle wafers on film frames or hoops, 100% saw-through (or as specified)
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Experience in image sensor dicing, RFID, solar panels, bonded wafers (Si on glass) MEMS devices
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Non-standard mask layouts (for handling many different size die on one substrate)
-
Fully automatic saws for high production runs
-
Surfactants and CO2 bubbler available
-
Small or large quantities for all materials
-
Custom dicing (slotting, multi depth, bevel, and angle cutting)
-
Wafer sizes from .25” to 12” (300mm) diameter
-
Substrates from .002" up to .6" thick
-
Handle wafers on film frames or hoops, 100% saw-through (or as specified)
-
Experience in image sensor dicing, RFID, solar panels, bonded wafers (Si on glass) MEMS devices
-
Non-standard mask layouts (for handling many different size die on one substrate)