FREQUENTLY ASKED QUESTIONS
American Dicing has experience in dicing many different materials including, but not limited to, silicon, soda lime glass, Borofloat® glass, GaAs, ceramic, SiC, sapphire, quartz, fused silica, Germanium Piezoceramics, multilayer FR4 boards, gallium, graphite, Graphene, aluminum nitrate, lithium niobate, metal coated glass and silicon wafers (Au, Ti, Ag, etc), ferrite, garnet, plastic, Pyrex, solar cells, and yttrium oxide.
We have experience in dicing bonded wafers combining glass/silicon glass stacks, silicon to silicon, glass bonded to glass, ceramic bonded to glass, and many other combinations.
Our dicing cost is evaluated based on wafer material, size, requested final part size, and any special needs. Please request a quote that we will tailor to your dicing requirements.
We are happy to accommodate this request. Customers frequently provide us with a sample or test wafer of identical material to evaluate our dicing before proceeding. Doing so enables us to develop an optimized dicing process.
At American Dicing, we love a challenge. We have diced into everything from triangles, hexagons, octagons to 360° circles. We can dice pizza-masked wafers, and we have experience with submounts. Please reach out to us to discuss your needs.
Many customers send us photoresist-coated wafers. We also offer a proprietary ADI coating, which we apply in-house and remove before shipping. This coating protects the wafer surface from dicing debris and anything else that may cause damage.
Our quality inspection team inspects any work completed at American Dicing.
We inspect all incoming wafers upon arrival and evaluate the work throughout the dicing process. A final inspection is completed before shipment. Using calibrated microscopes and automated inspection machines, our quality inspectors evaluate wafers for topside chipping, backside chipping, and final part-side measurements.
For an additional charge, we can provide a complete inspection report of all measured parameters.
After diced, wafers are shipped on reusable (versus disposable) frames and shippers for a small charge. If the wafers are on UV tape, the tape will be exposed before shipping so the final product can be removed from your end. These reusable frames may be returned for future work, reducing your costs.
Alternatively, we offer other die sorting or packaging services to get your final product to you in the desired format.
Currently many members of our team have been with us for 10+ years. The most experienced members have been working for over 20 years and are always on hand to provide knowledge and expertise to others.
While our turnaround can vary depending on our workload and the size of your job, we strive to get work done as fast as possible—often within a week. Additionally, we offer expedited services with a premium fee to move the job to the front of the line.
Following the completion and shipment of your job, we will send an invoice with a pay link. We accept credit cards, ACH payments, and checks.
Absolutely! One of our goals is to make the dicing industry a cooperative one. We want to support others as much as we have been supported over the years. We will do whatever we can to get you back and running. Contact us to discuss your needs.
