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Die Sorting Services
Specifications
Die sort into waffle packs, tape & reel, Gel-Paks, Jedec trays, or film-frame
Die sizes from .008" and up
Up to 12" Wafer diameter Capability
Ink dot or wafer map input
Flip Chip capability for bumped devices
Die sorting from wafers to new wafers with known good die
Manual pick and place for pressure sensitive parts
Vacuum seal dry packaging
Customized labeling
Die Sorters
DS4000
DS7000
DTS2 Pick & Place
ESC Magnum
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