Die Sorting Services
Pick, Place, and Sort into Tape Reel or Waffle Pack
Wafer dicing is the precise separation of individual die (chips or integrated circuits) from a semiconductor wafer. At American Dicing, we have expanded our dicing from semiconductor wafers to many other materials, including glass, sapphire, quartz, graphene, and ceramic. The list of materials we work with constantly expands as we develop new processes.
Our fully Automatic Die Sorters include wafer mapping and vision inspection before picking and place into a variety of outputs.
Die Sorting Process
Die Inspection before Pick
Our machines use visual inspection tools to automatically separate good dies from bad ones, including edge defect inspection and ink dot removal.
Wafer Mapping
Additionally, we can use provided electronic wafer maps to sort predetermined good/bad dies.
Multi Die Binning
We have multi-die binning capabilities to separate dies according to your specificities.
Die Sorters
Waffle Paks
Advantage
Small and thin, can get custom sizing for irregular shapes
Easy to handle
ESD and non ESD types available
Disadvantage
Typically single use only
If proper pack isn’t chosen die can rotate/flip
Lacks features to facilitate automation and large scale processes
Die Size Capability
0.008” and up
DS4000
DS7000
DTS2 Pick & Place
ESC Magnum
Specifications
Die sort into waffle packs, tape & reel, Gel-Paks, Jedec trays, or film-frame
Die sizes from .008" and up
Up to 12" Wafer diameter Capability
Ink dot or wafer map input
Flip Chip capability for bumped devices
Die sorting from wafers to new wafers with known good die
Manual pick and place for pressure sensitive parts
Vacuum seal dry packaging
Customized labeling
Jedec Trays
Advantage
Strong, stackable trays
Custom sized to grip die and minimize movement
Accommodate most standard components including BGA, CSP, QFP, TQFP, QFN, TSOP and SOIC
Disadvantage
Larger minimum order quantities, larger sized die specific
Die Size Capability
3 mm and up
Tape & Reel
Advantage
More common in large scale production, used in automated machines
Compact packaging, parts are sealed to protect from damage/dust during storage
Disadvantage
Not preferred with smaller die due to pocket tape limitations
Die Size Capability
~ 4 mm and up
Frames & Grip Ring Hoops
Advantage
Layout can be customized to suit your needs
Good die can be repopulated on tape removing all bad die
Disadvantage
Can be difficult to remove die from tape
Not optimal for long term storage as tape properties change over time
Die Size Capability
~ 0.008” and up
Gel-Paks®
Advantage
Die held by surface tension, prevent damage from edges/top of carrier
Smaller die are easily adhered to Gel Material preventing loss and movement during shipment
Disadvantage
Higher Cost
Slightly more difficult die removal due to adhesion to Gel
Lacks features to facilitate automation and large scale processes
Die Size Capability
< 10 mils – Gel-Pak Specific
Input Options
We can transfer die from tape, frames, hoops, tape and reel, or waffle packs to new desired outputs.
Traceabilty
We can maintain traceability of the die throughout the process on request.
Pick & Place Applications Setup
Multiple needle/collet configurations can be used to optimize sorting.
Die Inspection after Placement
Following sorting, the dies are inspected to ensure no damage occurs during picking/dicing
Lot Size
Small or large production job capabilities are available.
Wafer Size
Capabilities range from a small sample size to 12” Wafer capabilities.
Product Labeling
Once dies are sorted, we provide custom labeling, including bar or QR codes if desired.
Packaging before Shipment
Waffle Packs and Jedec trays can be vacuum-sealed for long-term storage.
Die Sorting Outputs
Depending on your requirements, wafers are sorted into various outputs.
Waffle-Paks • Gel-Paks® • Jedec Trays
Frames Tape and Reel • Grip-Ring hoops
