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Packaging Services
Specifications
Die Mount
Goldball Bond or Wedge Bond
Goldball bonding (0.0007” to 0.003” wire)
Aluminum wedge bonding (0.0007” to 0.025”)
Glob top or epoxy seal
Die Sizes From .008" and up
Wire pull and ball shear test
Die placement accuracy within +/- .001" on all die
Wirebonding
Bond
Wirebonding
Bond
Machines
Datacon 2200 Evo.
F&S Bontec Wirebonders
Nordson EFD Epoxy Dispensers
ASM Eagle Extreme
SEC 3088
K&S 1488
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