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Packaging Services

Precision Wire Bonding and Die Bonding

Wire, Wedge and TAB Bonding with Gold, Aluminum, or Copper. Automated Die Mounting and Expoxy Dispensing. Globe Top. Pull Testing. Pre and Post Inspections with Insepection Reports.

Specifications

Die Mount

Goldball Bond or Wedge Bond

Goldball bonding (0.0007” to 0.003” wire)

 

Aluminum wedge bonding (0.0007” to 0.025”)

Glob top or epoxy seal

Die Sizes From .008" and up

Wire pull and ball shear test

Die placement accuracy within +/- .001" on all die

Wirebonding

Bond

Wirebonding

Bond

Machines

Datacon 2200 Evo.

F&S Bontec Wirebonders

Nordson EFD Epoxy Dispensers

ASM Eagle Extreme

SEC 3088

K&S 1488

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