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Dicing Materials

At American Dicing, we have expanded our dicing from semiconductor wafers to many other materials, including glass, sapphire, quartz, graphene, and ceramic.  The list of materials we work with constantly expands as we develop new processes. 

Dicing Wafer + Substrate Materials List

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Alsimag
Alumina
AR Coated Glass
Barium Titinate
Bismuth Teluride
Borofloat
Carbide
Ceramics
Copper
Ferrite
FR4
Fused Silica
G10
Gallium Arsenide
Garnet
Germanium
Glass
Graphene
Kovar

Lead
Lithium
Lithium Niobate
Lithium Tantalate
Magnesium
Mold Compound
Natrium
Passinated Silicon
Plastic
PZT
Quartz
Ruby
Sapphire
Silicon
Silicon Carbide
Sodalime
Thin Films
Titanate
Titanium

Don’t see your material here?

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