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an American Dicing tech examines a semiconductor wafer
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QUALITY ASSURANCE

Quality Assurance and Inspection

At American Dicing we take pride in providing the best services we can.  We strive to provide excellent quality dicing with minimal yield loss. Our quality assurance team which inspects the work throughout the process.

PROCESS

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When wafers come into the facility they are first inspected to make sure that nothing happened during shipping

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The initial dicing cut is evaluated by both the dicer and our quality inspectors to ensure that the optimized set up is in place.  Following completion of the first wafer the inspectors ensure that the dicing matches the drawing provided.

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During dicing the dicer inspects every wafer.

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Upon completion of the work a final inspection is performed on every diced part by our quality inspectors to ensure that no errors or complications arose during the process.

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If any issues arise at any step of this process our team will contact you to discuss.

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Full inspection reports are also available to match your diced substrate.

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Dicing Inspection Equipment

American Dicing has both fully automated inspection machines as well as manual microscopes throughout the facility.

Fully automated Hitutoyo QV Active machines which enable full evaluation of the diced wafers.

Dynascope for dicing operators to use to evaluate chipping and cleanliness during dicing.

Our operators to use microscopes to check work throughout

Dicing inspection equipment including Fully automated Hitutoyo QV Active machines.
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