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A semiconductor wafer being diced by American Dicing
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Wire bonding on a microchip at American Dicing's facility
A die sorting unit sorts chips on a semiconductor
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Precision Wafer Dicing + Scribing Services

Packaging Services Include:
Die Mounting, Bonding + Wire Bonding

Die Sorting to Tape + Reel, Waffle Packs, Trays, or Hoops

American Dicing, Inc.

Wafer Dicing, Die Sorting & Packaging Services

Servicing microelectronic and miniature fabrication industries in the USA

Incorporated in 1993, American Dicing Inc. has experience in high precision dicing and scribing since 1987. We offer a broad range of services from prototypes to production volumes and the capability to work with wafers up to 12” in size.

We Provide an ESD Safe Environment at American Dicing

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Close up of an air ionizer in use at the American Dicing Facility
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Air Ionizers

A technician wears disposable protective clothing while inspecting a wafer dicing job
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Employee wrist straps, heel straps, & ESD safe smocks

Conductive flooring in use at American Dicing's facility reduces the buildup of static electricity, reducing the risk of electrostatic discharge (ESD)
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Conductive Flooring

air ionizer
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Air Ionizers

A worker conducts an internal audit to ensure safety
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Internal

Auditing

+ ESD

Training

grounded workstation
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Grounded workstations with constant monitors

Your Product is Safe with Us!

State-of-the-art facilities:

Production is done in a Class 10,000 Clean Room environment with Class 1,000 works stations.

Our staff is trained to handle your devices with care and precision.

american dicing tech holding a wafer that says on-time delivery or our service is free

Industries Served

Military • Aerospace • Medical  

RFID Communications • Scientific Universities

Research Labs • Commercial Electronics

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