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American Dicing, Inc.
Wafer Dicing, Die Sorting and Packaging Services
Servicing Industrial Control Systems in Northern New England
Incorporated in 1993, American Dicing Inc. has experience in high precision dicing and scribing for the microelectronic and miniature fabrication industries since 1987. We offer a broad range of services from prototypes to production volumes and the capability to work with wafers up to 12” in size.
Production is done in a Class 10,000 Clean Room environment with Class 1,000 works stations.
Our staff is trained to handle your devices with care and precision.
State-of-the-art facilities:
Your Product is Safe with Us!
On-time delivery or our service is free.
We Provide an ESD Safe Environment at American Dicing
Employee wrist straps, heel straps, & ESD safe smocks
Grounded workstations with constant monitors
Conductive Flooring
Air Ionizers
Internal
Auditing
+ ESD
Training
Industries Served
Military • Aerospace • Medical
RFID Communications • Scientific Universities
Research Labs • Commercial Electronics
PRECISION WAFER DICING & SCRIBER SERVICES
Precision Wafer Dicing + Scribing Services
DIE SORTING TO TAPE WHEEL, WAFFLE PACK TRAY, OR HOOPS.
Die Sorting to Tape + Reel, Waffle Packs, Trays, or Hoops.
Packaging services include die mounting, bonding, & wire bonding
Packaging Services Include:
Die Mounting, Bonding + Wire Bonding
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