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American Dicing, Inc.
Wafer Dicing, Die Sorting & Packaging Services
Servicing microelectronic and miniature fabrication industries in the USA
Incorporated in 1993, American Dicing Inc. has experience in high precision dicing and scribing since 1987. We offer a broad range of services from prototypes to production volumes and the capability to work with wafers up to 12” in size.
Precision Wafer Dicing + Scribing Services
Packaging Services Include:
Die Mounting, Bonding + Wire Bonding
Die Sorting to Tape + Reel, Waffle Packs, Trays, or Hoops
Precision Wafer Dicing + Scribing Services
Production is done in a Class 10,000 Clean Room environment with Class 1,000 works stations.
Our staff is trained to handle your devices with care and precision.
State-of-the-art facilities:
Your Product is Safe with Us!
We Provide an ESD Safe Environment at American Dicing
Employee wrist straps, heel straps, & ESD safe smocks
Grounded workstations with constant monitors
Conductive Flooring
Air Ionizers
Internal
Auditing
+ ESD
Training
Industries Served
Military • Aerospace • Medical
RFID Communications • Scientific Universities
Research Labs • Commercial Electronics
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