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American Dicing, Inc.

Wafer Dicing, Die Sorting and Packaging Services

Servicing microelectronic and miniature fabrication industries in the USA

Incorporated in 1993, American Dicing Inc. has experience in high precision dicing and scribing since 1987. We offer a broad range of services from prototypes to production volumes and the capability to work with wafers up to 12” in size.

Silicon wafers with red bg
Silicon Wafers
wafer background

Production is done in a Class 10,000 Clean Room environment with Class 1,000 works stations.

Our staff is trained to handle your devices with care and precision.

State-of-the-art facilities:

Your Product is Safe with Us!

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We Provide an ESD Safe Environment at American Dicing

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wafer fab

Employee wrist straps, heel straps, & ESD safe smocks

circuit board

Grounded workstations with constant monitors

clean room booties

Conductive Flooring

air ionizers

Air Ionizers

esd training

Internal

Auditing

+ ESD

Training

Industries Served

Military • Aerospace • Medical  

RFID Communications • Scientific Universities

Research Labs • Commercial Electronics

wafer dicing saw

PRECISION WAFER DICING & SCRIBER SERVICES

Precision Wafer Dicing + Scribing Services

die sorting service

DIE SORTING TO TAPE WHEEL, WAFFLE PACK TRAY, OR HOOPS.

Die Sorting to Tape + Reel, Waffle Packs, Trays, or Hoops.

wire bonding and die attach service

Packaging services include die mounting, bonding, & wire bonding 

Packaging Services Include:

Die Mounting, Bonding + Wire Bonding

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