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Wafer Dicing Services

High-Precision Silicon Wafer Dicing and Scribing

American Dicing offers high precision dicing and scribing of silicon wafers. We also handle cutting materials such as quartz and sapphire. Wafer production services include dicing of up to 12 inch wafers. Our wafer production facility is capable of handling small and large quantities of wafers and substrates.

Specifications

DICING:

Chamfered & Beveled

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SCRIBING:

Chamfered & Beveled

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WAFER SIZE:

Up to 12 Inch (300MM)

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KERF:

Down to 0.0005 inch (0.015mm)

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SUBSTRATE THICKNESS:

Up to 0.6 inch (15.24mm)

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MATERIALS:

Silicon, AR Coated Glass, Borofloat, Copper, Alumia, Fused Silica, Titanate, Sapphire, Quartz, Garnet, Mold Compound, Magnesium, Natrium, Thin Films, Sodalime, Lead, Ceramics, Lithium Niobate & Lithium Tantalate, Gallium Arsenide.

Dicing Saws

Dicing Saws

ADT

7100, 7134 & 7200

K&S

980 & 7500

7100 Series

Pro Vectus 2”

  • 8” chuck

  • Index accuracy — 1µm

  • Z accuracy — 1µm

  • 2" spindle — 60,000 RPM

  • Chuck flatness — 10µm

  • ø — closed loop Theta

  • Pattern recognition systems (PRS)

  • Load monitor

Pro Fortis 4”

  • Dice up to .600” thick

  • 4” spindle — 30,000 RPM

7134 Series

  • 12” Chuck

  • Index accuracy – 1.0 µm

  • Z accuracy – 1.0 µm

  • 4” Spindle – 30,000 RPM

  • ø stroke - 380° for circle dicing capabilities 

  • Dice material up to .600” thick

  • Full auto alignment as well as kerf check and cut verification

7200 Series

MegaDice

  • Fully automatic — 12” capability

  • 2”-3” high-torque

  • DC-brushless

  • Air-bearing

  • 2.4KW

  • 60,000 RPM spindle

  • Optimized for package singulation and IC applications

  • Fully automatic saws for high production runs

  • Surfactants and CO2 bubbler available

  • Small or large quantities for all materials

  • Custom dicing (slotting, multi depth, bevel, and angle cutting)

  • Wafer sizes from .25” to 12” (300mm) diameter

  • Substrates from .002" up to .6" thick

  • Handle wafers on film frames or hoops, 100% saw-through (or as specified)

  • Experience in image sensor dicing, RFID, solar panels, bonded wafers (Si on glass) MEMS devices

  • Non-standard mask layouts (for handling many different size die on one substrate)

  • Fully automatic saws for high production runs

​

  • Surfactants and CO2 bubbler available

​​

  • Small or large quantities for all materials

​​

  • Custom dicing (slotting, multi depth, bevel, and angle cutting)

​​

  • Wafer sizes from .25” to 12” (300mm) diameter

​​

  • Substrates from .002" up to .6" thick

​​

  • Handle wafers on film frames or hoops, 100% saw-through (or as specified)

​​

  • Experience in image sensor dicing, RFID, solar panels, bonded wafers (Si on glass) MEMS devices

​​

  • Non-standard mask layouts (for handling many different size die on one substrate)

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