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Packaging Services

Precision Wire Bonding and Die Bonding

Wire, Wedge and TAB Bonding with Gold, Aluminum, or Copper. Automated Die Mounting and Expoxy Dispensing. Globe Top. Pull Testing. Pre and Post Inspections with Insepection Reports.

Specifications

Die Mount

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Goldball Bond or Wedge Bond

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Goldball bonding (0.0007” to 0.003” wire)

 

Aluminum wedge bonding (0.0007” to 0.025”)

Glob top or epoxy seal

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Die Sizes From .008" and up

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Wire pull and ball shear test

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Die placement accuracy within +/- .001" on all die

Wirebonding

Bond

Wirebonding

Bond

Machines

Datacon 2200 Evo.

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F&S Bontec Wirebonders

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Nordson EFD Epoxy Dispensers

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ASM Eagle Extreme

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SEC 3088

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K&S 1488

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